Electroplating Thickness Measurer (Japan TH-11P)

Minimum Measurement Unit: 0.01㎛ or 0.1㎛
Measurement Diameter: SS1.6 mm S2.5 mm, L3.4 mm
Accuracy: ±5% of measurement value
Plating Type: Cu, Ni, Cr, Zn, Sn, Ag, etc.

※ Potentiometer (same equipment with different stand)

PTMDD Adhesion Tester (Digital)

Separation Load: .1-5,000 g
Separation Velocity: 25㎜/min, 50㎜/min
Separation Distance: 100㎜
Installation of a safety system for Go and Return
Power: AC 220V 60Hz
Size: 580 × 400 × 700(H) ㎜

PAC1 Plating Test Suite Set

Plating Solution: 500㏄
Put the plating solution into the test suite, and set the air agitation and temperature using the unit. Fix the anode onto the wall, and fix the cathode to the movable busbar. The plating experiment can be conducted while flowing DC power.

UV/Vis Spectrophotomete

Model: Optizen POP
OPTIZEN POP은 자외선과 가시광선 대역에서 시료의 파장별 투과도 또는 흡광도를 측정하여 이로부터 농도나 순도 등의 정량적 특성을 파악할 수 있습니다.

Metrohm 888 Titrando

Metallographic Microscope Model: MA100N / Nikon

Constant Temperature and Humidity Chamber

Thermal Shock Tester

Salt Water Spray

Water Resistance Tester